The Semiconductor Advanced Packaging Market is projected to expand by USD 22.79 billion, with a CAGR of 8.72% from 2023 to 2028. Key factors contributing to this growth include advancements in semiconductor IC designs that enable more sophisticated chips. Innovations in 3D chip packaging are crucial for improving performance and functionality within compact spaces. The emergence of Fan-Out Wafer-Level Packaging (FO WLP) is also revolutionizing the market, offering superior electrical performance and reduced package sizes